Submitted by Strong-Ball-1089 t3_ynh6ss in askscience
evranch t1_ivalv0z wrote
Reply to comment by dirtyuncleron69 in What is the cause of the steep escarpment at the base of Olympus Mons? by Strong-Ball-1089
Great link, such detailed study into a niche problem with wide ranging effects.
I've always thought there was something behind the higher failure rate of electronics post-ROHS, and it's interesting to see that milspec still requires lead in coatings. Personally I still use lead solder and find a lot of failed modern electronics can be repaired for good by simply reflowing them with a touch of 60/40.
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