From the article

>The pilot facility aims to prove out Fabric8Labs’ ability to economically 3D print very complex parts, especially using copper, for its top target markets, which include semiconductor heat sinks and radio frequency antenna parts.

Also from the article

>To keep central processors in powerful computers for overheating, manufacturers deploy heat sink structures to better ventilate the space around the processors. Fabric8Labs can produce these increasingly intricate designs at scale through its non-thermal metal 3D printing process.

Note: This is a demo of their pitch they provided 2 years ago in order to provide reference and some context of their technique